• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Resin is moulded to seal electronic parts mounted on lead frames (14) using a moulding unit (5) having a mould (26,28) with resin supply pots (29) arranged in it, resin pressurising plungers being provided on the pots, cavities in surfaces of the mould, and resin passages between the cavities and the pots. The number of moulding units is adjusted by detachably mounting an additional moulding unit (5a,5b,5c) with respect to the unit already provided, supplying unsealed lead frames (14) with electronic parts mounted on them and resin tablets (21) into each moulding unit, moulding the resin to seal the parts using the units, and taking out the sealed parts from each unit to the exterior. Also claimed is appts. for moulding resin to seal electronic parts using the method including means for taking out the sealed parts from the moulding unit to the exterior, the additional units being detachably mountable with respect to the already provided moulding unit to enable their number to be freely increased or decreased.
    公开号:NL9900013A
    申请号:NL9900013
    申请日:2001-03-13
    公开日:2001-06-01
    发明作者:Kazuhiko Bandoh
    申请人:Towa Corp；
    IPC主号:
    专利说明:

    Method and device for molding resin to seal electronic parts.
    Description
    The present invention relates to a method and an apparatus for forming resin to seal electronic parts, for sealing electronic parts such as ICs, LSIs, diodes or capacitors mounted on conductor frames with a resin material.
    Generally, electronic parts are sealed with molded resin by transfer molding, by a resin molding / sealing device having the following basic construction:
    Such a resin molding / sealing device comprises a mold having fixed and movable molded parts placed opposite one another, resin material supply containers arranged in the mold, plungers mounted on the pressurization containers the resin, cavities provided in mold surfaces of the fixed and movable molded parts opposing each other, respectively, and resin passages provided between the holders and the cavities
    Resin tablets are fed into the containers while the electronic parts applied to the conductor frames are fed and placed at prescribed positions of the cavities, and the mold is closed. The resin tablets provided in the containers are heated and pressurized so that the resin materials melted in the containers are injected and loaded into the cavities provided in the side portions of the containers through the resin passages, respectively. Thus, the resin is formed to seal electronic parts which are respectively received in the cavities.
    When a mass production mold is used for the above arrangement, this leads to the following problems:
    For example, the die that inevitably increases in weight and size is difficult to handle while it is difficult to keep the accuracy of die operation constant. Thus, portions of the mold differ in terms of resin molding conditions. Particularly in the manufacture of products such as electronic parts to be sealed with molded resin under the requirement of high quality and high reliability, the cavities may not be partially filled with resin, or open spaces or defective parts may be formed in the interior and sealing the exterior of the compressions due to such a difference in the resin molding / sealing conditions, to extremely reduce the quality of the products. Furthermore, in order to keep the die equal in accuracy, the die and the device increase in cost.
    Furthermore, resin burrs stick to the mold surfaces in such a large amount that the total molding time increases because it takes time to remove the resin burrs, resulting in an extreme decrease in productivity.
    In addition, a mass production mold to be applied to the above conventional device is inevitably limited in size and production quantity because in this case it is also necessary to consider the size of a mold closing mechanism or the like.
    The die provided in the above conventional device is generally suitable for simultaneously forming the same type of compressions. Therefore, in order to form different types of compaction fingers, it is necessary to exchange the die applied; is on the device for molding itself. Furthermore, in order to simultaneously form different types of compressions by the same molding apparatus, it is necessary to change the design of the mold itself or to apply different types of molds to the apparatus simultaneously.
    However, when the die applied to the molding device itself is frequently changed to form different types of compactions, the operation of exchanging the die is troublesome and productivity decreases. When the design of the die applied to the molding device itself is changed to be able to form different types of compressions simultaneously, the design of the die becomes complicated and the use of the die is limited by the design, leading to backlog in general and an increase in costs for the mold and the molding device.
    When a plurality of molds of different types are simultaneously applied to the molding device, the molds themselves must be reduced due to the constraint of the spaces for receiving them, resulting in a complicated mold design and reduction of productivity. For example, when a plurality of molding devices are used independently of each other, in accordance with the number of different types of compressions for solving this problem, the cost of the production plant increases disadvantageously.
    In a conventional method of forming resin to seal electronic parts, on the other hand, an unsealed conductor frame supply step for supplying unsealed conductor frames to prescribed positions of cavities provided in a mold, a resin tablet supply step for feeding resin tablets into containers provided in the mold, a step of removing a sealed conductor frame for taking the sealed conductor frames from the mold to the exterior, and a step of cleaning a mold surface for cleaning of mold surfaces of the mold after resin molding / sealing, generally sequentially performed independently of one another.
    In such a conventional method of molding resin to seal electronic parts, the total molding time increases so that productivity decreases extremely.
    An object of the present invention is to provide a method and an apparatus for molding resin to seal electronic parts, which are easily suitable for the production of electronic parts to be sealed with molded resin in small and large quantities, for forming products of high quality and reliability without voids or flaws formed in the interior and exterior of the compacts as they are sealed.
    Another object of the present invention is to provide a resin molding method and apparatus for sealing electronic parts which are easily suitable for simultaneous production of different types of compressions to form the products with high quality and high reliability .
    Yet another object of the present invention is to provide a method of molding resin to seal electronic parts that can produce sealed compressions of electronic parts with high efficiency by reducing the overall time of molding resin around electronic parts to seal.
    In order to achieve the above objects, a method of forming resin to seal electronic parts according to a first aspect of the present invention has been made suitable for sealing electronic parts applied to conductor frames with a molded resin material by molding units each having a mold, resin supply containers provided in the mold, resin pressurization plungers provided in the holders, cavities provided in mold surfaces of the mold, and resin passages provided between the cavities and the holders. According to the present method, the number of molding units is adjusted by releasably arranging an additional molding unit relative to those already provided on a resin molding device to seal electronic parts. Then unsealed conductor frames with electronic parts are applied thereon and resin tablets are supplied to each molding unit. Then the electronic parts are sealed with molded resin by each molding unit, and taken out to the outside.
    According to the present method, it is possible to use the unit as one having a minimum of molding units for molding resin to seal electronic parts, while it is also possible to use it as one having a plurality of molding units simple combination of an additional molding unit with the minimum of molding units.
    Therefore, it is possible simply a resin molding device to form electronic parts suitable for mass production without the mold itself increasing in size. Furthermore, it is also possible simply to form a resin molding device to seal electronic parts that can withstand production in small quantities without the die itself increasing in size because the additional molding unit can be properly detached.
    Namely, it is possible to arbitrarily and easily adjust the number of the molding units provided on the molding apparatus in response to the production amount as required. Thus, it is possible to easily cope with production in clay quantities and mass production of resin molding to seal electronic parts.
    According to the present method, it is further possible to simply form a resin molding device for sealing electronic parts suitable for mass production without the mold itself increasing in size, thus producing products of high quality and high reliability have been produced with high efficiency without voids or defective parts formed in the interior and exterior of sealed electronic part compressions.
    In a preferred embodiment, the respective steps of the method of forming resin to seal electronic parts according to the first aspect of the present invention are performed as follows:
    In a step of feeding unsealed conductor frames with electronic parts mounted thereon and resin tablets to each molding unit, a number of unsealed conductor frames with electronic parts applied thereto, fed to and placed at prescribed positions of a unit for feeding a conductor frame and then transferred to a guide frame alignment unit to be aligned in a prescribed direction. After a prescribed number of resin tablets are supplied to a resin tablet ejection unit and aligned, the unsealed conductor frames and the resin tablets are transferred to a free space between fixed and movable molded parts provided in the molding unit, such that the unsealed conductor frames and the resin tablets are fed to prescribed positions of cavities and containers provided in the molding unit, respectively.
    In a step of molding resin to seal electronic parts, the fixed and movable molded parts are closed while the resin tablets provided in the containers are heated and pressurized to be melted so that molten resin materials are injected and loaded into the cavities through resin passages, to be formed to seal the electronic parts contained in the cavities.
    In a step of taking out the sealed electronic parts from each molding unit to the exterior, the conductor frames sealed by the above molding / sealing step are taken from the fixed and movable moldings to the exterior, while mold surfaces of the fixed and movable molded parts are cleaned. Thereafter, the sealed conductor frames are transferred to a position of a sprue removal unit so that access portions thereof are removed. Thereafter, the sealed conductor frames are transferred to a conductor frame storage unit for independent recording and storage in the storage unit.
    In a more preferred embodiment of the method of forming resin to seal electronic parts in accordance with the first aspect of the present invention, the molding unit already provided and another molding unit are adapted to form resin to seal different types of electronic parts so that different types of products are simultaneously sealed with molded resin parallel to each other by these molding units.
    In accordance with the present invention, it is possible to couple molding units together in response to the number of different types of products, for simultaneously sealing the respective types of products parallel to each other. It is thus possible to efficiently handle mass production of a number of types of electronic parts.
    A method of forming resin to seal electronic parts according to a second aspect of the present invention includes a step of feeding unsealed conductor frames, a step of feeding resin tablets, a step of closing top and bottom lower moldings, a step of molding resin to seal electronic parts, and a step of removing the sealed conductor frames, as well as a step of cleaning the respective mold surfaces of the upper and lower moldings. The feature of the present method is that the steps of cleaning the mold surfaces, feeding unsealed conductor frames, and feeding resin tablets are performed simultaneously in parallel with the step of removing the sealed conductor frames.
    According to the present method, the step of cleaning the mold surfaces is performed with the step of removing the sealed conductor frames, while the steps of feeding the unsealed conductor frames and the resin tablets are also performed at the same time. Thus, it is possible to perform the steps of taking out the sealed conductor frames and cleaning the mold surfaces parallel to each other, while it is also possible to complete the steps of feeding unsealed conductor frames and then feeding of the resin tablets in parallel to each other. Therefore, a waiting time for subsequent resin molding operations to seal electronic parts is reduced, making it possible to reduce the total molding time.
    In a preferred embodiment of the method of forming resin to seal electronic parts according to the second aspect of the present invention, related steps are performed as follows: In a step of taking out the sealed conductor frames, a unloading unit is advanced in a free space between top and bottom moldings to engage the sealed conductor frames, and then is retracted in this state to take out the sealed conductor frames to the exterior of the top and bottom moldings.
    On the other hand, in a step of feeding unsealed conductor frames, a loading unit is advanced into the free space between the upper and lower moldings with retraction of the unloading unit, to supply unsealed conductor frames to the prescribed positions of cavities provided in the top and bottom moldings.
    In a step of feeding resin tablets, the loading unit is advanced into the free space between the top and bottom moldings with retraction of the unloading unit to feed the resin tablets to the containers. In a step of cleaning mold surfaces, a cleaning unit is moved through the free space between the upper and lower mold parts to clean the mold surfaces thereof.
    According to the present method, it is also possible to perform the steps of feeding unsealed conductor frames and the resin tablets simultaneously with advancing the loading unit into the free space between the upper and lower moldings.
    It is also possible to perform the step of cleaning the mold surfaces with the cleaning unit in the withdrawal of the unloading unit.
    Furthermore, the step of cleaning the mold surfaces can be performed simultaneously parallel to the step of removing the sealed conductor frames.
    The step of cleaning the mold surfaces can be performed by withdrawing the cleaning unit mounted on the unloading unit with it upon withdrawing the unloading unit in the step of removing the sealed conductor frames.
    An apparatus for performing the method of molding resin to seal electronic parts in accordance with the first aspect of the present invention includes a molding unit, a mechanism for feeding unsealed conductor frames with electrical parts mounted thereon and resin tablets to the molding unit , and a mechanism for taking out the electronic parts as they are sealed from the molding unit to the exterior. The feature of this device lies in the fact that another molding unit can be detachably mounted with respect to the molding unit already provided, so that the number of the molding units can be increased / decreased.
    An apparatus for performing the method of molding resin to seal electronic parts according to the second aspect of the present invention includes a molding unit, a mechanism for feeding an unsealed conductor frame, a mechanism for feeding a resin tablet, a mechanism for closing the mold and a mechanism for removing sealed conductor frames as well as a mechanism for cleaning a mold surface for cleaning the respective mold surfaces of a mold. The resin tablet feeding mechanism is configured to interlock with the sealed conductor frame removal mechanism so that unsealed conductor frames can be fed simultaneously with the sealed conductor frame removal operation.
    The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description with reference to the accompanying drawings.
    Figures 1A and 1B are a schematic plan view and a schematic enlarged front view of a resin molding device for sealing electronic parts according to the present invention, which combines a minimum of molding units for molding resin to seal electronic parts to close.
    Figure 2 is a schematic top view showing the resin molding device for sealing electronic parts shown in Figures 1A and 1B in combination with an additional molding unit.
    Figure 3 is a schematic enlarged front view of the resin molding device for sealing electronic parts of Figure 2.
    Figure 4 is a schematic plan view showing a resin molding apparatus for sealing electronic parts shown in Figures 1A and 1B in combination with a plurality of additional molding units.
    Figure 5 is a schematic, enlarged side view of the resin molding device for sealing electronic parts according to Figures 1A and 1B.
    Figures 6A through 6D illustrate steps of taking out sealed conductor frames and storing them in storage cassettes.
    Figure 7 is a schematic plan view showing a coupling portion between the resin molding device for sealing electronic parts shown in Figures 1A and 1B and another molding unit and engaging means in the coupling portion between the molding units,
    An embodiment of the present invention is now described with reference to the drawings.
    Referring to Figures 1A and 1B, a resin molding device for sealing electronic parts according to an embodiment of the present invention comprises a lead frame feeding unit 1 for feeding unsealed conductor frames with electronic parts mounted thereon, a unit 2 for aligning a conductor frame for aligning the unsealed conductor frames in a prescribed direction, a unit 3 for feeding a resin tablet for feeding resin tablets, an ejection unit 4 for a resin tablet for aligning the resin tablets and outputting them, a molding unit 5 for molding resin to seal electronic parts, a loading unit 6 for transferring the conductor frames and the resin tablets aligned with each other to the molding unit 5, a unloading unit 7 for taking out the conductor frames as they are sealed jn, a cleaning unit 8 for a mold, a transfer unit 9 for transferring the sealed conductor frames, a unit 10 for removing sprues for removing sprues from the sealed conductor frames, a receiving unit 11 for receiving the sealed conductor frames such as they are independently cleared of sprues, a guide frame storage unit 12 for storing the sealed conductor frames whose sprues have been removed in respective cassettes independently of each other, and a control unit 13 for continuously and automatically controlling the operations of the above units.
    The above conductor frame feed unit 1 is provided with an in-cassette placed portion 16 which stores a plurality of unsealed conductor frames 14 with electronic parts mounted thereon, and an appropriate pushing mechanism 17 for transferring the unsealed conductor frames 14 from the in-cassette 15 to the conductor frame alignment unit 2 independently of one another.
    The conductor frame alignment unit 2 is provided with an appropriate alignment mechanism 18 for aligning the unsealed conductor frames 14 received from the conductor frame feed unit 1 with each other in a prescribed direction.
    While two unsealed conductor frames 14 are aligned in parallel to each spike and a conversion / alignment mechanism provided for converting one of the unsealed conductor frames 14 in response to a mold construction design in the molding unit 5 in Figures 1A and 1B, it is not necessary to convert each reed sealed conductor frame when the die design is suitable to feed a single unsealed conductor frame 14.
    The resin tablet supply unit 3 is provided with resin tablet feeders 19 in a number corresponding to that of the containers provided in the molding unit 51
    The resin tablet feeders 19 are arranged in a manner corresponding to the number of containers provided in the molding unit 5 and gaps therebetween, and are integrally contained in a required resin tablet cassette 20 for ease of handling.
    The resin tablet feeders 19 can be suitably replaced by suitable means when the mold design is changed in the molding unit 5> in response to the number of new containers and gaps between them.
    As shown in Figure 3, the resin tablet output unit 4 is provided with a suitable resin tablet pushing mechanism 22 for storage in the resin tablet feeders 19 provided in the resin tablet supply unit 3, in states aligned with each other.
    The molding unit 5 includes a fixed plate 25 attached to an upper part of a body 23 of the device by tie bars 24, a fixed upper molding 26 mounted on the fixed plate 25, a movable lower molding 28 opposite mounted below the fixed top mold part 26 to be driven vertically by a required mold switching mechanism 27, and a plurality of (seven in Figure 1A) holders 29 mounted on the movable bottom mold part 37
    Furthermore, plungers are included in the respective holders 29 for pressurizing the resin tablets 21 and heating means such as heating means are provided on the upper and lower mold parts 26 and 28, while required numbers of cavities opposite each other for mold surfaces are provided in mold surfaces The top and bottom moldings 26 and 28 and resin passages (not shown) are provided between the holders 29 and the cavities.
    When the top and bottom moldings 26 and 28 are closed and the resin tablets 21 provided in the respective containers 29 are heated and pressurized, molten resin material can thereby be injected / charged into the respective cavities through the resin passages.
    The loading unit 6 is provided with a loading device 30 for simultaneously transferring two unsealed conductor frames 14 aligned with each other by the unit 2 for aligning a conductor frame and a plurality of (seven in Figure 1A) resin tablets 21 aligned and outputted from the resin tablet ejection unit 4 to the molding unit 5
    The loading device 30 is adapted to reciprocate between positions of the conductor frame alignment unit 2 and the molding unit 5 »for receiving two unsealed conductor frames 14 by an appropriate mechanism (not shown) during recording of the respective resin tablets 21 outputted from the resin tablet ejection unit 4 by an appropriate mechanism (not shown) in the position of the unit 2 for aligning a guide frame (see figure 3)
    At this time, two unsealed conductor frames 14 and the respective resin tablets 21 are received by the loading device 30 in the same manner as a mold design in the molding unit 5. Thus, it is possible to supply two unsealed conductor frames 14 and the respective resin tablets 21 to prescribed positions of the cavities or the holders 29 by transferring them to portions above the movable lower molding 28 of the molding unit 5 and releasing them from the receiving condition.
    While it is advantageous to simplify the overall construction of the device and to reduce the overall molding time because the loading device 30 simultaneously transfers the unsealed conductor frames 14 and the respective resin tablets 21, mechanisms for transferring conductor frames 14 and the resin tablets 21 can alternate are provided independently of each other so that these transfer mechanisms are independently driven.
    The unloading unit 7 is provided with a unloading device 31 for taking out the conductor frames 14 which are sealed with molten liars in the molding unit 5 to the exterior of the top and bottom mold parts 26 and 28.
    This releasing device 31 is adapted to reciprocate relative to the position of the molding unit 5. to be able to take out two sealed conductor frames 14 and a spigot integrated therebetween to the exterior in a state that 3 it has been simultaneously recorded by an appropriate mechanism (not shown).
    The cleaning unit 8 is provided with an air blowing mechanism for blowing air to the mold surfaces of the upper and lower mold parts 26 and 28 provided in the molding unit 5 and a vacuum mechanism (not shown) for sucking dust from the mold surfaces .
    Furthermore, the cleaning unit 8 is integrated with the unloading device 31 of the unloading unit 7. Thus, the cleaning unit 8 is adapted to move back and forth simultaneously with a unloading unit 7 relative to the position of the forming unit 5 ·
    Furthermore, the cleaning unit 8 is driven when the unloading unit 7 receiving the sealed conductor frames 14 is withdrawn to the exterior, for example, to extract dust from the mold surfaces by the effects of the air blowing and vacuum mechanisms and storing them in a appropriate collector part 32 / ear fabric. Thus, it is possible to simply and efficiently clean the mold surfaces prior to subsequent resin molding.
    While it is possible to simplify the overall construction of the device and reduce the total molding time due to the integral construction of the unloading unit 7 and the cleaning unit 8, these units 7 and 8 can be alternately formed to become independent of each other powered.
    Furthermore, the cleaning unit 8 may, for example, be provided with a brush member for vigorously separating resin burrs adhering to the mold surfaces and a driving mechanism therefor.
    As shown in Figures 6A, 6B and 6D, the above transfer unit 9 for the sealed conductor frames 14 is provided with an appropriate pallet 33 that reciprocates to transfer the sealed conductor frames 14 taken out by the unloading unit 7 to positions of the sprue removal unit 10 and the guide frame storage unit 12.
    As shown in Figure 6B, the sprue removal unit 10 is provided with a sprue break mechanism 34 for removing the sprue section defined between the sealed conductor frames 14 which are transferred by the transfer plate 33 of the transfer unit 9- This Sprue break mechanism 34 is adapted to receive two sealed conductor frames 14 which are coupled / integrated with each other through a port portion 35 as shown in Figure 1A, for example, by an appropriate mechanism (not shown) and around the sprue portion 35 determined is pressurized between the conductor frames 14 in this state for cutting / removing them.
    As shown in Figures 6C and 6D, the receiving unit 11 further includes a receiving mechanism 36 for receiving two sealed conductor frames 14 which are independently transferred from the unit 10 to remove sprues by the pallet 33 from the transfer unit 9
    This take-up mechanism 36 can receive two sealed conductor frames 14 which have been transferred by the pallet 33 of the transfer unit 9 independently, as shown in Figure 6C.
    The conductor frame storage unit 12 is provided with storage cassettes 37 capable of storing two sealed conductor frames 14 independently received by the take-up mechanism 36 of the take-up unit 11 independently of one another.
    The two sealed conductor frames 14, which are independently received by the pick-up mechanism 36 of the pick-up unit 11, are released from the pick-up mechanism 36 when the pallet 33 of the transfer unit 9 is retracted to its original position so that it can be stored in the prescribed storage cassettes 37 independently provided under these as shown in Figure 6D.
    The control unit 13 is capable of continuously and automatically controlling the operations of the above units, for forming resin to seal electronic parts in the following manner, for example:
    Two unsealed conductor frames 14 provided in the in-cassette 15 of the conductor frame feeding unit 1 are independently transferred by a pusher mechanism 17 to the conductor frame alignment unit 2.
    Then, the two unsealed conductor frames 14 are aligned in the prescribed direction by the alignment mechanism 18 unit 2 for aligning a conductor frame.
    Following or in parallel with the above steps of transferring two unsealed conductor frames 14 and aligning them, the seven resin tablets 21 are aligned and outputted by the resin tablet supply unit 3 and the resin tablet ejection unit 4.
    Then, the two unsealed conductor frames 14 provided in the conductor alignment unit 2 and the seven resin tablets 21 provided in the resin tablet supply unit 3 are transferred to a free space between the upper and lower molding parts 26 and 28 of the molding unit 5 by the loading device 30 of the loading unit 6, and these are released from the loading device 30 so that the unsealed conductor frames 14 are supplied to prescribed positions of the cavities provided in the movable lower molding part 28 while the respective resin tablets 21 are supplied to the holders 29
    Then, the upper and lower mold parts 26 and 28 are closed by the switch mechanism 27 of the mold while the resin tablets 21 received in the holders 29 are heated and pressurized to be melted so that molten resin materials are injected / loaded into the cavities, respectively. permeable to the resin and, for sealing the electronic parts contained in the cavities, respectively.
    Then, the guide frames 14 which are sealed are taken out from the top and bottom mold parts 26 and 28 of the molding unit 5 to the exterior by the unloader 31 of the unloading unit 7. while the mold surfaces of the top and bottom mold parts 26 and 28 are cleaned by the air blowing and vacuum mechanisms of the cleaning unit 8 upon withdrawal from the unloader 31 so that dust is sucked away from the mold surfaces.
    Then, the guide frames 14 taken out by the unloading unit 7 are transferred to the position of the unit 10 for removing sprues from the pallet 33 of the transfer unit 9.
    Then, the sprue section 35 is cut between the sealed conductor frames 14 and removed by the sprue break mechanism 34 of the sprue removal unit 10.
    Then the two unsealed guide frames 14 separated from each other by removing the sprue portion 35 are transferred to the position of the guide frame storage unit 12 by the pallet 33 of the transfer unit 9
    Then, the two sealed conductor frames 14 which are separated from each other are independently received by the receiving mechanism 36 of the receiving unit 11.
    Then, the pallet 33 of the overseas unit 9 is withdrawn and the two sealed conductor frames 14 are released from the take-up mechanism 36 of the take-up unit 11, to be stored independently in the respective storage cassettes 37-
    Gripping means 38 are provided on a right end portion of a bottom base 39 of the molding unit 5 to be coupled to another molding unit as described later.
    As described above, the resin molding device for sealing electronic parts as shown in Figures 1A and 1B is formed by a combination of a minimum of molding units for resin molding to seal electronic parts.
    Furthermore, in this resin molding device to seal electronic parts, the series of steps are continuously and automatically performed by the control unit 13.
    Figures 2 & 3 illustrate the electronic molding resin molding device formed by the combination of the minimum units shown in Figures 1A & 1B combined with an additional molding unit 5 & performing the same function as that of the molding unit 5 and FIG. 4 shows the device combined with a plurality of additional molding units 5b and 5c.
    The additional molding units 5a, 5b and 5c are identical in construction to the above molding unit 5 and releasably attached to a side portion of the molding unit 5 provided in the resin molding device for electronically sealing parts formed by the combination of the minimum units shown in Figures 1A and 1B.
    Therefore, it is possible to realize a resin molding apparatus for electronically sealing parts suitable for mass production with molds substantially increased in size by sequentially installing the additional molding units 5a. 5b and 5c on the side portion of the molding unit 5 of the resin molding device for electronically sealing parts formed by the combination of the minimum units shown in Figures 1A and 1B.
    Namely, it is possible to arbitrarily and easily adjust the number of molding units arranged in the above device in response to the production quantity as it is reformed. It is thus possible to easily handle production of sealed electronic parts in small and large quantities as required.
    When the electronic molding resin molding device is combined with the additional molding units, it is possible to use most of the devices provided in the electronic molding resin molding device formed by the combination of the minimum units shown in Figures 1A and 1B as such.
    Namely, it is possible to mainly use the unit 1 for feeding an unsealed conductor frame, the unit 2 for aligning a conductor frame, the unit 3 for feeding a resin tablet, the ejection unit 4 for a resin tablet, the loading unit 6 , the unloading unit 7. the cleaning unit 8, the transfer unit 9. the unit 10 for removing sprues, the receiving unit 11, the storage unit 12 for a guide frame and the control unit 13 as such by changing control conditions by the control unit 13 in response on the number of form units as used.
    The gripping means 38 are provided between the molding unit 5 of the resin molding device for sealing electronic parts realized by the combination of the minimum of units shown in Figures 1A and 1B and the additional molding unit 5a coupled on or detached from them, for easy and reliable positioning of the molding units 5 and 5a and coupling them together.
    The gripping means 38 may be formed by irregular gripping parts formed on bottom bases 39 of the molding units 5 and 5a as shown in Figures 3 and 7. For example.
    In the state shown in Figs. 2 and 4, the resin molding device for electronically sealing parts is suitable for molding resin for simultaneously sealing the same kind of products by steps that are essentially identical to those in the state shown in Figures 1A and 1B, with the addition of the following steps:
    In addition to the steps performed in the electronic molding resin molding device formed by the combination of the minimum units, the same kind of products are sealed in the additional molding units 5a, 5b and 5c by a step of transferring unsealed conductor frames 14 and resin tablets 21 from the conductor frame alignment unit 2 and the resin tablet supply unit 3 to the additional molding units 5a, 5b and 5c during setting these in prescribed positions with the loading unit 6, a step of molding resin to electronically seal parts by the additional molding units 5a, 5b and 5c, a step of taking out the conductor frames 14 as they are sealed by the unloading unit 7 »a step of cleaning from the mold surfaces by the cleaning unit 8, a step of transferring the sealed conductor frames 14 to a position of the unit 10 for removing sprues by the transfer unit 9. a step of cutting / removing sprues 35 defined between the sealed conductor frames 14 by the sprue removal unit 10, a step of transferring the sealed conductor frames 14 as released of sprues are to the position of the conductor frame storage unit 12 by the transfer unit 9. a step of receiving the sealed conductor frames 14 from the position of the conductor frame storage unit 12 by the receptacle 11, and a step of storing of the sealed conductor frames 14 received by the recording unit 11 in the storage cassettes 37
    At present, most of the means provided in the resin molding device for sealing electronic parts formed by the combination of the minimum units shown in Figures 1A and 1B are used as such as above described. Therefore, periods for starting resin molding steps to seal electronic parts in the respective molding units 5a, 5b and 5c can be set at prescribed time gaps.
    Also when the molding units 5a, 5a, 5b and 5c are different from each other in terms of die twerp in the tiars molding device for sealing electronic parts having the estra molding units 5a, 5b and 5c as shown in Figures 2 and 4 for forming different types of products in the molding units 5, 5a, 5b and 5c, it is possible to use most of the units provided in the device shown in Figures 1A and 1B as such.
    In this case, the unit 1 for supplying an unsealed conductor frame may be provided with in-cassette 15 in a number corresponding to that of the various mold designs, while the conductor frame storage unit 12 may be provided with storage cassettes 37 in a number corresponding to that of in-cassettes 15.
    When the numbers of containers 29 provided in the molding units 5, 5a, 5b and 5c and the numbers and shapes of the conductor frames 14 are different from each other, the respective units can be provided with functions that can be changed / adjusted in response thereon, in addition to the in-cassettes 15 and the storage cassettes; 37 which are provided in numbers corresponding to those of the different mold designs.
    For example, the resin tablet supply unit 3, the resin tablet ejection unit 4, the loading unit 6, the unloading unit 7, the sprue removal unit 10 and the receiving guide 11 can be provided with functions that can be changed / changed. passes are consistent with changes in number of holders 29 and number and shape of guide frames 14.
    Alternatively, the additional molding units 5a, 5b and 5c may be provided with specific loading units, specific unloading units, specific digestion units or specific receiving units.
    While the additional molding units 5a, 5b and 5c are identical, the molding unit 5 «, mold designs thereof may be different from each other in response to compressions to be formed, for producing different types of compressions in the molding units 5, 5 & 5b and 5c . Furthermore, the additional molding units 5a, 5b and 5c can be releasably mounted on the side portion of the molding unit 5 provided in the resin molding device for sealing electronic parts formed by a combination of the minimum units that is shown in Figures 1A and 1B.
    Therefore, it is possible to easily realize a resin molding device for sealing electronic parts that mainly comprises a plurality of dies by sequentially mounting the additional molding units 5 &. 5b and 5c on the resin molding device for sealing electronic parts formed by the combination of the minimum of units.
    On the other hand, it is also possible to realize a resin molding device for sealing electronic parts which has a substantially small number of dies by successively removing the additional mold parts 5a. 5b and 5c or stopping its operations.
    In other words, the number of mold units can be arbitrarily and easily adjusted in the above device in response to the required production quantity, making it possible to easily and quickly handle a case of simultaneous manufacturing of different types of products in small or large quantities while also it is possible to handle a case of simultaneous manufacture of the same kind of products in small or large quantities.
    When the resin molding device for sealing electronic parts in the state shown in Figures 2 to 4 is capable of simultaneously forming different kinds of products, steps of forming additional products in the additional molding units 5a 5b and 5c are added to the above steps performed in the device formed by the combination of the minimum of resin molding units to seal electronic parts.
    When the above steps of molding resin to seal electronic parts are performed continuously and automatically, it is possible to produce sealed compressions of electronic parts with high efficiency while reducing the overall molding time by performing the above steps of feeding and removing the relevant members and cleaning the mold surfaces parallel to each other.
    Parallel to the step of feeding an unsealed conductor frame for transferring unsealed conductor frames 1b to the free space between the upper and lower mold parts 26 and 28 provided in the molding unit 5 and feeding the reed sealed conductor frames 14 to the prescribed positions of the cavities provided in the top and bottom moldings 26 and 28, the step of feeding a resin tablet for transferring resin tablets 21 to the free space between the top and bottom moldings 26 and 28 provided in the molding 5 and feeding it to the holders 29 provided in the lower molding. 28 so that these steps can be performed essentially one step at a time, thereby reducing the overall molding time.
    Furthermore, it is possible to reduce the total molding time by simultaneously performing the step of taking out a sealed conductor frame to advance the unloading unit 7 into the free space between the upper and lower mold parts 26 and 28, while removing the sealed conductor frames 14 engaged and the unloading unit 7 is withdrawn in this state to take out the sealed conductor frames 1b to the exterior of the top and bottom moldings 26 and 28 with the step of cleaning the mold surfaces of the top and bottom moldings 26 and 28.
    In this case, the step of cleaning the mold surface / lacquer can be performed simultaneously with the withdrawal of the release unit. 7, whereby these steps can be performed essentially in a single step time.
    Additionally, a step of feeding unsealed conductor frames 14 is provided to be substantially sealed to the prescribed positions of the cavities provided in the top and bottom moldings 26 and 28 by advancing the loading unit 6 into the free space between the upper and lower mold parts 26 and 28 in the above withdrawal of the unloading unit 7 -
    Furthermore, a step of feeding a resin tablet for feeding resin tablets 21 which is used for the next sealing operation in the holders 29 of the lower mold part 28 can be performed simultaneously with the above advancement of the loading unit | 6.
    Namely, it is possible to propel the loading unit ó | upon withdrawal of the unloading unit 7 to be carried out substantially simultaneously and the steps of feeding the unsealed conductor frames 14 and the resin tablets 21 through the loading unit 6.
    Thus, it is possible to further reduce the total molding time by performing the step of removing a sealed conductor frame, the step of cleaning a mold surface, the step of feeding an unsealed conductor frame and the step of feeding substantially simultaneously of a resin tablet parallel to each other within a short time.
    As described above, it is possible to perform the step of supplying an unsealed conductor frame and the step of supplying a resin tablet with the step of removing a sealed conductor frame during performing the step of cleaning a mold surface.
    Thus, it is possible to reduce the total molding time by substantially performing the step of removing a sealed conductor frame simultaneously with the step of cleaning a mold surface, the step of feeding an unsealed conductor frame and the step of feeding a resin tablet parallel to each other.
    The above embodiment is suitable for extracting the sealed conductor frames from the top and bottom moldings 26 and 28 to the exterior through the unloader 31 during cleaning of the mold surfaces of the top and bottom moldings 26 and 28 by drawing dust away from the die surfaces by air blowing and vacuum mechanisms provided in the cleaning unit 8 upon withdrawal of the unloader 31 Furthermore, the embodiment is also suitable for performing the steps of feeding an unsealed conductor frame and a resin tablet substantially simultaneously the loading unit 6 upon withdrawal of the unloading device 31
    Namely, the steps of feeding unsealed conductor frames and resin tablets are performed simultaneously with the step of cleaning the mold surface before withdrawing the releasing device 31 in this case. According to this embodiment, it is therefore possible to take the step of removing the sealed conductor frame, the step of cleaning a mold surface, the step of supplying an unsealed conductor frame and the step of supplying a resin tablet parallel to each other within a can be performed essentially simultaneously for a short time.
    However, if the unsealed conductor frames 14 become contaminated with dust on the mold surfaces during an actual operation due to the above simultaneous execution of the steps of feeding the unsealed conductor frames 14 and the resin tablets 21 with the step of cleaning a mold surface for example, the steps of feeding an unsealed conductor frame and a resin tablet can be performed continuously following the step of cleaning a mold surface to solve this problem.
    While the steps of feeding an unsealed conductor frame and a resin tablet cannot be performed simultaneously to the step of cleaning a mold surface in this case, it is possible to minimize the loss of molding time as well as produce products of high quality and have high reliability by performing the steps of feeding an unsealed conductor frame and a resin tablet immediately after the step of cleaning a mold surface.
    While the present invention has been described and clarified in detail, it is to be understood that this is by way of illustration and example only and should not be construed as limiting, the scope and scope of the present invention being limited only by the terms of the accompanying conclusions.
    权利要求:
    Claims (8)
    [1]
    A method of forming resin for sealing electronic parts, comprising a step of feeding unsealed conductor frames for transferring unsealed conductor frames to a free space between an upper molded part and a lower molded part in a molding unit for feeding of those unsealed conductor frames to prescribed positions of cavities in those upper and lower moldings, said step comprising advancing and moving a loading unit into and out of the free space between the upper and lower moldings, a step of feeding resin tablets to those free space between those upper and lower moldings in that molding unit and supplying them to containers provided in that lower molding, a step of closing the mold for closing those upper and lower moldings in that molding unit; a step of forming / sealing with resin by heating, pressing and melting those resin tablets supplied to those containers during the injection and loading of molten resin materials into those cavities through resin passages provided between those containers and those cavities thereby forming resin around electronic parts mounted on those conductor frames contained in those cavities, a step of taking out a sealed conductor frame to take out those sealed conductor frames to that resin forming / sealing step from those top and bottom mold parts to the environment, said step comprising advancing and advancing a unloading unit into and out of the free space between the upper and lower moldings, a step of cleaning a mold surface for cleaning the respective mold surfaces of said upper and lower moldings, with the characterized in that propelling said loading unit into the free The space between the molded parts takes place when the loading unit has moved out of the free space.
    [2]
    A resin molding method according to claim 1, characterized in that said step of cleaning the mold surface comprises a step of moving a cleaning unit along said mold surfaces of said upper and lower mold parts to clean said mold surfaces. those top and bottom moldings.
    [3]
    A method of forming resin for sealing electronic parts according to claim 2, characterized in that said steps of feeding said unsealed conductor frame and said resin tablets are performed simultaneously while advancing said loading unit in said free space between those top and bottom moldings.
    [4]
    A molding resin method for sealing electronic parts according to claim 2, characterized in that said step of cleaning the mold is performed with said cleaning unit while moving back said loading unit.
    [5]
    The method of molding resin for sealing electronic parts according to claim 1, wherein said step of cleaning the mold surface is performed simultaneously parallel to said removal step of the conductor frame.
    [6]
    A resin molding method for sealing electronic parts according to claim 2, characterized in that said cleaning unit is integrated with said unloading unit for reciprocating relative thereto the step of cleaning the mold surface during retraction of said unloading unit.
    [7]
    A resin molding apparatus comprising a molding unit having a pair of molded parts, resin material supply containers arranged in that mold, resin pressurization plungers arranged in that mold, resin pressurization plungers provided on said containers wherein cavities are present in the respective mold surfaces of each mold and resin passages are provided between those containers and those cavities, feed means for unsealed conductor frames for transferring unsealed conductor frames into a free space between that pair of moldings of that molding unit and feed thereof to certain positions of those cavities, said supply means comprising a loading unit for moving in and out of the free space between the molded parts, supplying means for resin tablets for transferring resin tablets in that free space between that pair of molded parts of that voiding unit and supplying it in those holders; form closing means for closing said pair of form parts in said voiding unit; take-out means for sealed conductor frames for taking out those conductor frames from that pair of moldings to the environment, said take-out means comprising a unloading unit for moving in and out of the free space between the moldings; and mold surface cleaning means for cleaning the respective mold surfaces of said pair of molded parts, characterized in that the loading unit (6) advances into the molded parts when the unloading unit is moved back from the free space.
    [8]
    Resin molding device for sealing electronic parts according to claim 7, characterized in that said mold surface cleaning means (8) are integrated with said releasing unit (7) for reciprocating relative to said mold surfaces during pull back from that unloading unit.
    类似技术:
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JPS61148016A|1984-12-24|1986-07-05|Hitachi Ltd|Molding system|
    JPS63240035A|1987-03-27|1988-10-05|Matsushita Electric Works Ltd|Electronic component sealing and molding device|
    WO1991008095A2|1989-11-24|1991-06-13|Asm Fico Tooling B.V.|Single-strip moulding apparatus|
    法律状态:
    2001-06-01| A1A| A request for search or an international-type search has been filed|
    2002-04-02| BB| A search report has been drawn up|
    2002-09-02| BC| A request for examination has been filed|
    2003-09-01| BN| A decision not to publish the application has become irrevocable|
    优先权:
    申请号 | 申请日 | 专利标题
    JP20268993|1993-07-22|
    JP5202690A|JP2932137B2|1993-07-22|1993-07-22|Method and apparatus for resin sealing molding of electronic parts|
    JP5202689A|JP2932136B2|1993-07-22|1993-07-22|Method and apparatus for resin sealing molding of electronic parts|
    JP20269093|1993-07-22|
    JP34314193|1993-12-14|
    JP5343141A|JP2666041B2|1993-12-14|1993-12-14|Resin sealing molding method for electronic parts|
    NL9401211A|NL9401211A|1993-07-22|1994-07-22|Method and device for molding resin to seal electronic parts.|
    NL9401211|1994-07-22|
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